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Engineering (R0) eBook Series

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  • Electrical Design of Through Silicon Via

    Edited by Manho Lee, Jun So Pak, Joungho Kim ...
    Series series Engineering (R0)
    Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book ... Read more

    $89.09 USD