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Engineering (R0) eBook Series

Showing 1 - 12 of 12 results
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  • Fan-Out Wafer-Level Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, ... Read more

    $98.09 USD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    by John H. Lau ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... Read more

    $179.99 USD

  • Semiconductor Advanced Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, ... Read more

    $116.09 USD

  • Chiplet Design and Heterogeneous Integration Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous ... Read more

    $125.99 USD

  • Assembly and Reliability of Lead-Free Solder Joints

    by John H. Lau, Ning-Cheng Lee ...
    Series series Engineering (R0)
    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty ... Read more

    $107.09 USD

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  • Small Antennas:Miniaturization Techniques & Applications

    by John Volakis, Chi-Chih Chen, Kyohei Fujimoto ...
    Next-generation small antenna design techniquesThis authoritative text provides the most up-to-date methods on the theory and design of small antennas, including an extensive survey of small antenna literature published over the past several years. Written by experts at the forefront of antenna research, Small Antennas: Miniaturization Techniques & Applications begins with a detailed presentation ... Read more

    $91.59 USD

  • 3D IC Integration and Packaging

    by John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... Read more

    $186.29 USD

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ...
    Series series IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design ... Read more

    $130.00 USD

  • Advanced MEMS Packaging

    by Yu Aibin, Cheng Kuo Lee, C. S. Premachandran, John H. Lau ...
    A comprehensive guide to 3D MEMS packaging methods and solutionsWritten by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and ... Read more

    $144.99 USD

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Edited by Katsuyuki Sakuma ...
    Series series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Read more

    $79.99 USD

  • Microwave Bandpass Filters for Wideband Communications

    by Lei Zhu, Sheng Sun, Rui Li ...
    Series Book 232 - Wiley Series in Microwave and Optical Engineering
    This book will appeal to scientists and engineers who are concerned with the design of microwave wideband devices and systems. For advanced (ultra)-wideband wireless systems, the necessity and design methodology of wideband filters will be discussed with reference to the inherent limitation in fractional bandwidth of classical bandpass filters. Besides the detailed working principles, a large ... Read more

    $118.00 USD

  • Conducted Electromagnetic Interference (EMI) in Smart Grids

    by Robert Smolenski ...
    Series series Engineering (R0)
    As power systems develop to incorporate renewable energy sources, the delivery systems may be disrupted by the changes involved. The grid’s technology and management must be developed to form Smart Grids between consumers, suppliers and producers. Conducted Electromagnetic Interference (EMI) in Smart Grids considers the specific side effects related to electromagnetic interference (EMI) generated ... Read more

    $89.09 USD