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  • Assembly and Reliability of Lead-Free Solder Joints

    by John H. Lau, Ning-Cheng Lee ...
    Series series Engineering (R0)
    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty ... Read more

    $107.09 USD