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Showing 1 - 4 of 4 results for “jun so pak”
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  • General Education and the Development of Global Citizenship in Hong Kong, Taiwan and Mainland China

    Not Merely Icing on the Cake

    Edited by Jun Xing, Pak-Sheung Ng, Chloe Cheng ...
    Series series Routledge Research in Asian Education
    General Education has taken center stage in the greater China area (Hong Kong, Taiwan and mainland China) because of a number of important developments. First, globalization has created both opportunities and challenges for college students. When they graduate and enter the real world, they must have the cultural sensitivities and social skills, in addition to their professional training, to ... Read more

    $70.99 USD

  • Indigenous Culture, Education and Globalization

    Critical Perspectives from Asia

    Edited by Jun Xing, Pak-sheung Ng ...
    Series series Education (R0)
    The book explores the growing tension between indigenous education, the teaching and learning of native knowledge, cultural heritage and traditions and the dynamics of globalization from the Asian perspective. It brings together a distinguished and multidisciplinary group of Asian scholars and practitioners from Nepal, Korea, India, Japan, Thailand, Indonesia, the Philippines, Hong Kong, Taiwan, ... Read more

    $107.09 USD

  • Selected Contributions of 2024 2nd International Conference on Electric Vehicle and Vehicle Engineering

    Edited by Pak Kin Wong, Jun Xu ...
    Series series Springer Nature Proceedings excluding Computer Science
    This book presents an extensive exploration of the latest trends in Electric Vehicle and the boundless opportunities they offer. It has encompassed various facets including Intelligent Vehicle, Electric Vehicle Technology, Power Electronics and Motor Drives, Energy Systems and Storage, Electronic Control Systems, Battery Technologies, Autonomous and Connected Vehicles. The book is tailored for ... Read more

    $269.09 USD

  • Electrical Design of Through Silicon Via

    Edited by Manho Lee, Jun So Pak, Joungho Kim ...
    Series series Engineering (R0)
    Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book ... Read more

    $89.09 USD