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1 - 12 de 12 resultados para “john h lau”
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  • Fan-Out Wafer-Level Packaging

    de John H. Lau ...
    Series series Engineering (R0)
    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, ... Leer más

    $98.99 USD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    de John H. Lau ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... Leer más

    $179.99 USD

  • Semiconductor Advanced Packaging

    de John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, ... Leer más

    $116.99 USD

  • Assembly and Reliability of Lead-Free Solder Joints

    de John H. Lau, Ning-Cheng Lee ...
    Series series Engineering (R0)
    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty ... Leer más

    $107.99 USD

  • Heterogeneous Integrations

    de John H. Lau ...
    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for ... Leer más

    $152.99 USD

  • 3D IC Integration and Packaging

    de John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... Leer más

    $186.99 USD

  • Chiplet Design and Heterogeneous Integration Packaging

    de John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous ... Leer más

    $125.99 USD

  • Advanced MEMS Packaging

    de Yu Aibin, Cheng Kuo Lee, C. S. Premachandran, John H. Lau ...
    A comprehensive guide to 3D MEMS packaging methods and solutionsWritten by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and ... Leer más

    $144.99 USD

  • Through-Silicon Vias for 3D Integration

    de John H. Lau ...
    A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low ... Leer más

    $131.99 USD

  • Reliability of RoHS-Compliant 2D and 3D IC Interconnects

    de John H. Lau ...
    Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing ... Leer más

    $118.99 USD

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  • Small Antennas:Miniaturization Techniques & Applications

    de John Volakis, Chi-Chih Chen, Kyohei Fujimoto ...
    Next-generation small antenna design techniquesThis authoritative text provides the most up-to-date methods on the theory and design of small antennas, including an extensive survey of small antenna literature published over the past several years. Written by experts at the forefront of antenna research, Small Antennas: Miniaturization Techniques & Applications begins with a detailed presentation ... Leer más

    $91.99 USD

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    de Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ...
    Series series IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design ... Leer más

    $130.00 USD