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1 - 12 de 12 resultados para “chen yu huang”
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  • Electronic Materials Innovations and Reliability in Advanced Memory Packaging

    de Chong Leong Gan, Chen Yu Huang ...
    Series series Chemistry and Material Science (R0)
    This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and ... Leer más

    $161.99 USD

  • Interconnect Reliability in Advanced Memory Device Packaging

    de Chong Leong, Gan, Chen-Yu, Huang ...
    Series series Engineering (R0)
    This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of ... Leer más

    $197.99 USD

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  • Semiconductor Manufacturing Handbook, Second Edition

    de Hwaiyu Geng ...
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second ... Leer más

    $112.49 USD

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    de Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... Leer más

    $139.00 USD

  • Semiconductor Manufacturing Handbook

    de Hwaiyu Geng ...
    This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. ... Leer más

    $140.99 USD

  • 3D IC Integration and Packaging

    de John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... Leer más

    $186.99 USD

  • Flat Panel Display Manufacturing

    Edición de Jun Souk, Fang-Chen Luo, Shinji Morozumi, Ion Bita ...
    Series series Wiley Series in Display Technology
    An extensive introduction to the engineering and manufacture of current and next-generation flat panel displaysThis book provides a broad overview of the manufacturing of flat panel displays, with a particular emphasis on the display systems at the forefront of the current mobile device revolution. It is structured to cover a broad spectrum of topics within the unifying theme of display systems ... Leer más

    $143.00 USD

  • Electrical and Electronic Devices, Circuits and Materials

    Design and Applications

    de Suman Lata Tripathi, Parvej Ahmad Alvi, Umashankar Subramaniam ...
    The increasing demand in home and industry for electronic devices has encouraged designers and researchers to investigate new devices and circuits using new materials that can perform several tasks efficiently with low IC (integrated circuit) area and low power consumption. Furthermore, the increasing demand for portable devices intensifies the search to design sensor elements, an efficient ... Leer más

    $77.99 USD

  • Electrical Connectors

    Design, Manufacture, Test, and Selection

    Edición de San Kyeong, Michael G. Pecht ...
    Series series IEEE Press
    Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resourceElectrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and ... Leer más

    $127.00 USD

  • Chemical Process Retrofitting and Revamping

    Techniques and Applications

    Edición de Gade Pandu Rangaiah ...
    The proposed book will be divided into three parts. The chapters in Part I provide an overview of certain aspect of process retrofitting. The focus of Part II is on computational techniques for solving process retrofit problems. Finally, Part III addresses retrofit applications from diverse process industries.Some chapters in the book are contributed by practitioners whereas others are from ... Leer más

    $153.00 USD

  • 3D IC Stacking Technology

    de Banqiu Wu, Sesh Ramaswami, Ajay Kumar ...
    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry ... Leer más

    $139.49 USD

  • Advanced Flip Chip Packaging

    Edición de Yi-Shao Lai, C.P. Wong, Ho-Ming Tong ...
    Series series Engineering (R0)
    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better ... Leer más

    $152.09 USD