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stefan busse

Showing 1 - 12 of 12 results for “stefan busse
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  • Material-Integrated Intelligent Systems

    Technology and Applications

    Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems.The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three ... Read more

    $250.00 USD

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  • Automotive Buzz, Squeak and Rattle

    Mechanisms, Analysis, Evaluation and Prevention

    Buzz, squeak, and rattle (BSR) is the automotive industry term for the audible engineering challenges faced by all vehicle and component engineers. Minimizing BSR is of paramount importance when designing vehicle components and whole vehicle assemblies. This is the only book dedicated to the subject. It provides a self-contained reference to the background theory, testing, analysis, and ... Read more

    $89.09 USD

  • Nanoscale CMOS VLSI Circuits: Design for Manufacturability

    Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and ... Read more

    $113.39 USD

  • Advances in Automotive Production Technology – Towards Software-Defined Manufacturing and Resilient Supply Chains

    Stuttgart Conference on Automotive Production (SCAP2022)

    Series series Springer Nature Proceedings excluding Computer Science
    This volume of the series ARENA2036 compiles the outcome of the 2nd Stuttgart Conference on Automotive Production (SCAP2022).The peer-reviewed contributions in this book are arranged thematically in three parts and cover a wide variety of topics: (A) Software-defined Manufacturing, (B) Data-driven Technologies, and (C) Advanced Manufacturing and Sustainability.SCAP2022 was organized by ARENA2036 ... Read more

    Free

  • ESD Basics

    From Semiconductor Manufacturing to Product Use

    Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor ... Read more

    $92.00 USD

  • Interdisciplinary Mechatronics

    Engineering Science and Research Development

    Edited by M. K. Habib, J. Paulo Davim ...
    Mechatronics represents a unifying interdisciplinary and intelligent engineering science paradigm that features an interdisciplinary knowledge area and interactions in terms of the ways of work and thinking, practical experiences, and theoretical knowledge. Mechatronics successfully fuses (but is not limited to) mechanics, electrical, electronics, informatics and intelligent systems, intelligent ... Read more

    $158.00 USD

  • Flexible Automation and Intelligent Manufacturing: The Human-Data-Technology Nexus

    Proceedings of FAIM 2022, June 19–23, 2022, Detroit, Michigan, USA

    Series series Springer Nature Proceedings excluding Computer Science
    This is an open access book. It gathers the first volume of the proceedings of the 31st edition of the International Conference on Flexible Automation and Intelligent Manufacturing, FAIM 2022, held on June 19 – 23, 2022, in Detroit, Michigan, USA. Covering four thematic areas including Manufacturing Processes, Machine Tools, Manufacturing Systems, and Enabling Technologies, it reports on advanced ... Read more

    Free

  • Optically Amplified WDM Networks

    Edited by John Zyskind, Atul Srivastava ...
    With the advent of wavelength routing and dynamic, reconfigurable optical networks, new demands are being made in the design and operation of optical amplifiers. This book provides, for the first time, a comprehensive review of optical amplifier technology in the context of these recent advances in the field. It demonstrates how to manage the trade-offs between amplifier design, network ... Read more

    $116.99 USD

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    Series series IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design ... Read more

    $130.00 USD

  • Structural Health Monitoring of Large Civil Engineering Structures

    by Hua-Peng Chen ...
    A critical review of key developments and latest advances in Structural Health Monitoring technologies applied to civil engineering structures, covering all aspects required for practical applicationStructural Health Monitoring (SHM) provides the facilities for in-service monitoring of structural performance and damage assessment, and is a key element of condition based maintenance and damage ... Read more

    $110.00 USD

  • Systems, Controls, Embedded Systems, Energy, and Machines

    Series series The Electrical Engineering Handbook
    In two editions spanning more than a decade, The Electrical Engineering Handbook stands as the definitive reference to the multidisciplinary field of electrical engineering. Our knowledge continues to grow, and so does the Handbook. For the third edition, it has expanded into a set of six books carefully focused on a specialized area or field of study. Each book represents a concise yet definitive ... Read more

    $225.00 USD

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Edited by Katsuyuki Sakuma ...
    Series series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Read more

    $79.99 USD