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Top Series in United States

Showing 1 - 12 of 12 results for “jianping shi”
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  • Business Continuity Management System

    A Complete Guide to Implementing ISO 22301

    by Wei Ning Zechariah Wong, Jianping Shi ...
    A business continuity management system (BCMS) is a management framework that prepares the organization by developing business continuity strategies to meet its business and statutory obligations during an incident. It is about optimizing service availability and preserving business performance to secure future growth in the market.Business Continuity Management System offers a complete guide to ... Read more

    $46.79 USD

  • Multimaterial 3D Printing Technology

    by Jiquan Yang, Li Na, Jianping Shi, Wenlai Tang, Gang Zhang, Feng Zhang ...
    Series series 3D Printing Technology Series
    Multi-material 3D Printing Technology introduces the first models for complex construction and manufacturing using a multi-material 3D printer. The book also explains the advantages that these innovative models provide at various points of the manufacturing supply chain. Innovations in fields such as medicine and aerospace are seeing 3D printing applied to problems that require the technology to ... Read more

    $179.99 USD

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  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    by Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... Read more

    $139.00 USD

  • Flat Panel Display Manufacturing

    Edited by Jun Souk, Fang-Chen Luo, Shinji Morozumi, Ion Bita ...
    Series series Wiley Series in Display Technology
    An extensive introduction to the engineering and manufacture of current and next-generation flat panel displaysThis book provides a broad overview of the manufacturing of flat panel displays, with a particular emphasis on the display systems at the forefront of the current mobile device revolution. It is structured to cover a broad spectrum of topics within the unifying theme of display systems ... Read more

    $143.00 USD

  • Proceedings of the Scientific-Practical Conference "Research and Development - 2016"

    Edited by K. V. Anisimov, A. V. Dub, S. K. Kolpakov, A. V. Lisitsa, A. N. Petrov, V. P. Polukarov, O. S. Popel, V. A. Vinokurov ...
    Series series Springer Nature Proceedings excluding Computer Science
    This open access book relates to the III Annual Conference hosted by The Ministry of Education and Science of the Russian Federation in December 2016. This event has summarized, analyzed and discussed the interim results, academic outputs and scientific achievements of the Russian Federal Targeted Programme “Research and Development in Priority Areas of Development of the Russian Scientific and ... Read more

    Free

  • Measurement, Instrumentation, and Sensors Handbook

    Electromagnetic, Optical, Radiation, Chemical, and Biomedical Measurement

    Edited by John G. Webster, Halit Eren ...
    The Second Edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performing practical measurements in engineering, physics, chemistry, and the life sciences and discusses ... Read more

    $140.00 USD

  • 3D TCAD Simulation for CMOS Nanoeletronic Devices

    by Yung-Chun Wu, Yi-Ruei Jhan ...
    Series series Engineering (R0)
    This book demonstrates how to use the Synopsys Sentaurus TCAD 2014 version for the design and simulation of 3D CMOS (complementary metal–oxide–semiconductor) semiconductor nanoelectronic devices, while also providing selected source codes (Technology Computer-Aided Design, TCAD). Instead of the built-in examples of Sentaurus TCAD 2014, the practical cases presented here, based on years of teaching ... Read more

    $80.09 USD

  • Bioelectronics and Medical Devices

    Applications and Technology

    Edited by Garima Srivastava, Manju Khari ...
    This new volume provides an abundance of information on new biomedical applications being used today. The book covers a wide range of concepts and technologies, discussing such modern technological methods as the Internet of Things, e-pills, biomedical sensors, support vector machines, wireless devices, image and signal processing in e-health, and machine learning. It also includes a discussion on ... Read more

    $179.99 USD

  • Advanced Flip Chip Packaging

    Edited by Yi-Shao Lai, C.P. Wong, Ho-Ming Tong ...
    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better ... Read more

    $152.09 USD

  • Computer Science And Engineering Technology (Cset2015), Medical Science And Biological Engineering (Msbe2015) - Proceedings Of The 2015 International Conference On Cset & Msbe

    by Qingjun Liu, Jiamei Deng ...
    This book brings together 106 papers presented at the Joint Conferences of 2015 International Conference on Computer Science and Engineering Technology (CSET2015) and 2015 International Conference on Medical Science and Biological Engineering (MSBE2015), which were held in Hong Kong on 30-31 May 2015.The joint conferences covered a wide range of research topics in new emerging technologies, ... Read more

    $80.99 USD

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Edited by Katsuyuki Sakuma ...
    Series series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Read more

    $79.99 USD

  • Smart Sensors for Industrial Applications

    Edited by Krzysztof Iniewski ...
    Series series Devices, Circuits, and Systems
    Sensor technologies are a rapidly growing area of interest in science and product design, embracing developments in electronics, photonics, mechanics, chemistry, and biology. Their presence is widespread in everyday life, where they are used to sense sound, movement, and optical or magnetic signals. The demand for portable and lightweight sensors is relentless in several industries, from consumer ... Read more

    $150.00 USD