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  • 3D Interconnect Architectures for Heterogeneous Technologies

    Modeling and Optimization

    by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck ...
    Series series Engineering (R0)
    This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a ... Read more

    $107.09 USD